217 lines
16 KiB
JSON
217 lines
16 KiB
JSON
[
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{
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"id": 1,
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"chunk": "# Corkuna Introduction",
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"category": " Introduction"
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},
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{
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"id": 2,
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"chunk": "# Agenda \n\n \n\nCompany Introduction \n\nNano coating technology roadmap and application \n\nProduct Introduction (BEK/VCN)",
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"category": " Introduction"
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},
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{
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"id": 3,
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"chunk": "# Corkuna Facility",
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"category": " Introduction"
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},
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{
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"id": 4,
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"chunk": "# Background \n\n",
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"category": " Introduction"
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},
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{
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"id": 5,
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"chunk": "# Waterproof is a solid need for the electronics \n\n \nCell Phone \n\n \nWearable \n\n \nEarphone \n\n \nUnmanned aerial vehicle \n\n \nAutomotive",
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"category": " Introduction"
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},
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{
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"id": 6,
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"chunk": "# Background|Waterproof market analysis \n\nAT-RISK SYSTEMS MARKET \nTOTAL: 1,150Bn \n\n \nTOTAL: \\$950Bn \n\n<html><body><table><tr><td>System</td><td>CAAGR 2017-2022</td></tr><tr><td>Personal Computing</td><td>-1.1%</td></tr><tr><td>Other Computing/Infra.</td><td>8.4%</td></tr><tr><td>MobilePhones</td><td>2.5%</td></tr><tr><td>Communications Infra.</td><td>7.4%</td></tr><tr><td>Consumer</td><td>7.6%</td></tr><tr><td>Automotive</td><td>6.3%</td></tr><tr><td>Industrial</td><td>5.7%</td></tr><tr><td>Medical</td><td>3.7%</td></tr><tr><td>Military/Aerospace</td><td>5.2%</td></tr><tr><td>Total</td><td>3.9%</td></tr></table></body></html>\n\nN318.17 5jd-rugg ed",
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"category": " Introduction"
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},
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{
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"id": 7,
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"chunk": "# Our Timeline \n\n \n\ngeneration coating product with 2 components and more features planned. \n\nBEK series launched.",
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"category": " Introduction"
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},
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{
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"id": 8,
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"chunk": "# Company Introduction \n\nCorkuna HQ (SH) \n\nR&D/Production Center \n\nSales Office \n\nVietnam Office (CQ1 2020) \n\nOversea office-CUPT (on going) \n\n",
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"category": " Introduction"
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},
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{
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"id": 9,
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"chunk": "# Company Introduction| Core Technical Team \n\n",
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"category": " Introduction"
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},
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{
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"id": 10,
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"chunk": "# Technical Roadmap \n\n",
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"category": " Introduction"
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},
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{
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"id": 11,
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"chunk": "# Core Technology \n\n",
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"category": " Introduction"
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},
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{
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"id": 12,
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"chunk": "# Molecular Design & synthesis \n\nCoating chemicals molecular Coating structure Molecular self assembly \n\n \n\nCoating Chemicals Lean Production \n\nManufacture under inert protection Package under inert protection \n\n \n\nRecipe Design & Formulation \n\n$\\spadesuit.$ Synergistic technology $\\spadesuit$ Chemical interface modification \n\n",
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"category": " Materials and methods"
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},
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{
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"id": 13,
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"chunk": "# Coating Process Design \n\n$\\spadesuit$ Surface treatment $\\spadesuit$ Spray/Dispensing $\\spadesuit$ Automation",
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"category": " Materials and methods"
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},
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{
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"id": 14,
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"chunk": "# Application background| Development and Trend",
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"category": " Introduction"
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},
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{
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"id": 15,
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"chunk": "# Electronics W/P market Share trend in 2022 \n\n \nElectronics W/P market Share in 2017",
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"category": " Results and discussion"
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},
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{
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"id": 16,
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"chunk": "# W/P Application Category \n\n",
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"category": " Results and discussion"
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},
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{
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"id": 17,
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"chunk": "# Mechanical protection \n\n• Semipermeable vents, cover, foam tape, rubber sealing, etc. • Easy to design and easy to use \n\n \n\nBarrier for smaller and more delicate structural design. Not fully waterproof.",
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"category": " Materials and methods"
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},
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{
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"id": 18,
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"chunk": "# Potting \n\n• Direct filling on interior PCB boards, etc. • Complete sealing and protection. \n\n \n\nHard for repairing. \nHeat spreading problems.",
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"category": " Results and discussion"
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},
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{
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"id": 19,
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"chunk": "# PCB board surface conformal coating \n\n• Direct coating on PCB board. \nComplete coverage. \nSaves space for structural design. \nGood for heat spreading. \n\n",
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"category": " Results and discussion"
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},
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{
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"id": 20,
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"chunk": "# Conformal Coating Category \n\n",
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"category": " Introduction"
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},
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{
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"id": 21,
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"chunk": "# Waterproof paint layer \n\nSpecial paint with waterproof feature Easy to apply. Lower in cost. \n\n \n\nOnly provides a covering layer with basic $w/p$ function. Not complete W/P Rubber-based. Not solvent free",
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"category": " Results and discussion"
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},
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{
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"id": 22,
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"chunk": "# Nano Coating Layer \n\nVery thin layer of specially designed molecules coated on PCB \nApplied with glue dispenser/PVD/CVD, etc. \nVery good water and grease proof feature with functional molecule designing. \nEnvironmental-friendly.",
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"category": " Materials and methods"
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},
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{
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"id": 23,
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"chunk": "# Application |PCB Nano Coating \n\n \n\nWater/salt/dust/grease proof. \n\nHard surface substrate for protection. \n\nFill the gaps and fissures. \n\n \n\n\\*Notice: if on FPC board coating may be required to withstand some shape changing $\\mid\\rightarrow$ flexibility features also recommended. \n\n",
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"category": " Results and discussion"
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},
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{
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"id": 24,
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"chunk": "# Application| PCB Nano Coating Methods \n\n \n\n \n\n",
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"category": " Results and discussion"
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},
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{
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"id": 25,
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"chunk": "# PVD \n\nPhysical vapor deposition. Gasified coating material deposits on the surface forming a very thin protection layer. Higher cost. Longer time. Flexibility cannot be convinced.",
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"category": " Materials and methods"
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},
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{
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"id": 26,
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"chunk": "# CVD \n\nChemical vapor deposition. Coating layer is formed through deposition (similar to PVD) and chemical reaction on surface. Higher cost. Longer time. Flexibility cannot be convinced.",
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"category": " Materials and methods"
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},
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{
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"id": 27,
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"chunk": "# Soaking \n\nSoak the PCB board directly in the solution of coating material. \nWith time a protection film will cover the surface. \nEasy, less time but lower coverage \nespecially in small gaps.",
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"category": " Materials and methods"
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},
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{
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"id": 28,
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"chunk": "# Application| PCB Nano Coating Methods",
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"category": " Introduction"
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},
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{
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"id": 29,
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"chunk": "# Spraying through dispenser \n\n \n\nEasier and convenient to control the coating evenness, thickness and qty of coating material \nHigh coverage even in gaps and fissures with different spraying angles and spraying pressure adjustment \nShorter time and less cost compared with PVD/CVD. \n\n",
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"category": " Results and discussion"
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},
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{
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"id": 30,
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"chunk": "# Application| PCB Nano Coating Methods \n\n",
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"category": " Results and discussion"
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},
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{
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"id": 31,
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"chunk": "# Product Introduction | BEK Series \n\n \n\nGood adhesion to PCBs, glass, metal, modified plastic, resin and ceramic. \n\nOne step to use with glue dispenser. \n\nFor general PCB/FPC and module coating. \n\n",
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"category": " Introduction"
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},
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{
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"id": 32,
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"chunk": "# Product Introduction | BEK Series TDS \n\n \n\n<html><body><table><tr><td colspan=\"2\">Properties of Post Treatment Coating</td></tr><tr><td>Coating thickness</td><td>300nm-15um (in accordance with customer needs)</td></tr><tr><td>Glossiness</td><td>High</td></tr><tr><td>Adhesion Cross-Cut Test</td><td>5B</td></tr><tr><td>Abrasion Test</td><td>5000t - 10oo0t (Depend with the usage and substrates)</td></tr><tr><td>Anti-corrosion in salt solution</td><td>Excellent</td></tr><tr><td>Water Contact Angle (Coated on Glass)</td><td>110° (Depend with the usage and substrates)</td></tr><tr><td>Transmittance % (Coated on Glass)</td><td>93% (Glass=91~92%)</td></tr><tr><td>Fluorescent inspection</td><td>Yes</td></tr><tr><td>Working in water</td><td>Electronic Product, No Shell, Over 60min by coating 5-10g/m² (the lifetime for coated electronics working in Water is depended with the usage. )</td></tr></table></body></html>",
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"category": " Results and discussion"
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},
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{
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"id": 33,
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"chunk": "# Product Introduction | VCN L1-B and L2 Combo \n\n \n\nVCN L1-B: better inner structural filling and better flexibility \n\nVCN L2: Repels water and oil on the surface. Also providing hard surface texture \n\nSpecial reaction between groups of L1-B and L2 molecules $\\rightarrow$ strong linking and adhesion. \n\nTwo steps to apply VCN L1-B and L2 on the surface.",
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"category": " Introduction"
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},
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{
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"id": 34,
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"chunk": "# Product Introduction | VCN L1-B and L2 Combo",
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"category": " Introduction"
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},
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{
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"id": 35,
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"chunk": "# SEM pictures of VCN L1-B AND l2 layer \n\n \n\n \n\n \n\nThe FESEM picture of VCN L1-B displayed a Hilly-like and porous structures that own the high specific surface area can bond with VCN L2. \n\nThe FESEM picture of VCN L2 displayed a high densely and homogenously structures. \n\nThe FESEM picture of coated VCN L1-B and L2 that displayed the multilayer and high densely structure.",
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"category": " Results and discussion"
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},
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{
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"id": 36,
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"chunk": "# Product Introduction | VCN L1-B and L2 Combo \n\n",
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"category": " Introduction"
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},
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{
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"id": 37,
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"chunk": "# Product Introduction | VCN L1-B and L2 Combo TDS \n\n \n\n<html><body><table><tr><td colspan=\"4\">Properties of Post Treatment Coating</td></tr><tr><td rowspan=\"2\">Dielectric Constant</td><td>2.96(@1MHZ)</td><td>1.669(@1MHZ)</td><td></td></tr><tr><td colspan=\"2\">2.97@10kHZ, 2.75@100kHZ, 2.58@1MHZ (Combined)</td><td></td></tr><tr><td>Dielectric Strength (Fully curing)</td><td colspan=\"3\">> 200V/um (Combined)</td></tr><tr><td>Hardness</td><td colspan=\"3\">2-3H (Coated on Glass substrate)</td></tr><tr><td>Surface Resistance (@24 °C Humidity 50%) Water Contact Angle (Coated on Glass)</td><td colspan=\"2\">6.5x1011 @500V (Combined) 106° - 110° (Depend with the usage and substrates)</td><td></td></tr><tr><td>Transmittance % (Coated on Glass)</td><td>86 % (Glass=91%)</td><td>92 % (Glass=91%)</td><td></td></tr><tr><td>Volume Resistivity Ohms, 24 C, 50% RH</td><td></td><td>8.45x1013@500V (Combined)</td><td></td></tr><tr><td>Dissipation Factor</td><td colspan=\"3\">0.01-0.02@10kHZ, 0.016-0.017@100kHZ, 0.017-0.018@1MHZ (Combined)</td></tr></table></body></html>",
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"category": " Results and discussion"
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},
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{
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"id": 38,
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"chunk": "# Product Introduction | Salt Mist Comparison \n\n<html><body><table><tr><td colspan=\"5\">Salt mist comparison test result</td></tr><tr><td>Category</td><td>NO coating</td><td>Competitor A</td><td>Competitor B</td><td>VCN coating</td></tr><tr><td>Post 24hrs</td><td></td><td></td><td></td><td></td></tr><tr><td> Post 48hrs</td><td></td><td></td><td></td><td></td></tr><tr><td>Post 72hrs</td><td></td><td></td><td></td><td></td></tr><tr><td>Post 96hrs</td><td></td><td></td><td></td><td></td></tr></table></body></html>",
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"category": " Results and discussion"
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},
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{
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"id": 39,
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"chunk": "# Product Introduction | Application Method \n\n \n\nPCB or FPC fixed in clips then put in the convey belt. \n\nPlasma surface cleaning and pretreatment \n\nCoating \n\nCuring in tunnel oven under certain condition \n\nFinished product. Can be checked under UV light.",
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"category": " Materials and methods"
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},
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{
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"id": 40,
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"chunk": "# Corkuna Facility|Production facility \n\n1. VCN L2 production line \n2. VCN L1-B production line \n3. BEK-04 production line \n4. Auto packing line \n\n \n\n",
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"category": " Materials and methods"
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},
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{
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"id": 41,
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"chunk": "# Corkuna Facility|Production facility \n\nFlow velocity adjusting during production. \n\n \n\nCross control material input \n\nSample collection for quality check. \n\nFinished product packing.",
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"category": " Materials and methods"
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},
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{
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"id": 42,
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"chunk": "# Corkuna Facility | Testing Equipment \n\n",
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"category": " Materials and methods"
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},
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{
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"id": 43,
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"chunk": "# Corkuna Facility | Application Equipment \n\n \nHeating chamber \n\nGlue dispenser \n\nLaser Demask",
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"category": " Materials and methods"
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}
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] |